CUHK Scholarships for Local and Non-Local Undergraduate Students in Hong Kong, 2018
Scholarship Description: The Chinese University of Hong Kong (CUHK) is offering scholarships to both local and non-local new undergraduate students on the basis of their outstanding academic or non-academic performance.
About University: The Chinese University of Hong Kong (CUHK) is a public research university in Shatin, Hong Kong formally established in 1963 by a charter granted by the Legislative Council of Hong Kong.
Degree Level: Scholarships are available for pursuing undergraduate programme.
Available Subject: Scholarships are awarded to study the subjects offered by the university.
Scholarship Benefits: The value of each Admission Scholarship ranges from HK$5,000 to a full-tuition coverage. Some of the Admission Scholarships will also include an allowance of up to HK$45,000 per year. Many of the Admission Scholarships are renewable for the normative period of study programme subject to satisfactory academic progress.
Eligibility: Students who have attained the qualifications as stipulated below will be eligible for Admission Scholarships.
(I) For Local Students
- JUPAS: Outstanding students admitted to the University on the basis of the Hong Kong Diploma of Secondary Education (HKDSE) results.
- Non-JUPAS: Non-JUPAS local students with outstanding results in GCE A-Level/ IB Diploma/ SAT/ OSSD/ B.C. Diploma or equivalent/ ATAR/ Taiwan GSAT/ Cambridge Pre-U examinations, etc.
(II) For Non-local Students
- Students from the Mainland China: Non-local students from the Mainland China with outstanding JEE (Joint Entrance Examination) results.
- Students from other regions: Non-local students from other regions with outstanding academic achievements.
Eligible Nationalities: Scholarships are open to both local and non-local students.
Application Procdure: There is no need for the students to apply for these scholarships. The University will identify qualified new students and inform the selected students of the scholarship offers.
Deadline: The application deadline is January 3, 2018.